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| MMBD4148/SE/CC/CA MMBD4148/SE/CC/CA Connection Diagram 4148 3 3 3 4148SE 3 2 1 1 5H 2 MARKING 5H MMBD4148CA D6 MMBD4148 MMBD4148CC D5 MMBD4148SE D4 1 4148CC 3 1 3 2 4148CA SOT-23 1 2 1 2 Small Signal Diode Absolute Maximum Ratings * Symbol VRRM IF(AV) IFSM TA = 25C unless otherwise noted Parameter Maximum Repetitive Reverse Voltage Average Rectified Forward Current Non-repetitive Peak Forward Surge Current Pulse Width = 1.0 second Pulse Width = 1.0 microsecond Storage Temperature Range Operating Junction Temperature Value 100 200 1.0 2.0 -55 to +150 150 Units V mA A A C C TSTG TJ * These ratings are limiting values above which the serviceability of the diode may be impaired. Thermal Characteristics Symbol PD RJA Parameter Power Dissipation Thermal Resistance, Junction to Ambient Value 350 357 Units mW C/W Electrical Characteristics Symbol VR VF IR TA=25C unless otherwise noted Parameter Breakdown Voltage Forward Voltage Reverse Leakage Current Test Conditions IR = 5.0A IR = 100A IF = 10mA VR = 20V VR = 20V, TA = 150C VR =75V VR = 0V, f = 1.0MHz IF = 10mA, VR = 6.0V, IRR = 1.0mA, RL = 100 Min. 75 100 Max. Units V V V nA A A pF ns 1.0 25 50 5.0 4.0 4.0 CT trr Total Capacitance Reverse Recovery Time (c)2004 Fairchild Semiconductor Corporation MMBD4148/SE/CC/CA, Rev. A1 MMBD4148/SE/CC/CA Typical Characteristics 150 Ta= 25 C 300 Ta= 25 C Reverse Voltage, V R [V] Reverse Current, IR [nA] 1 2 3 5 10 20 30 50 100 140 250 200 130 150 120 100 50 110 0 Reverse Current, IR [uA] 10 20 30 50 70 100 Reverse Voltage, V R [V] Figure 1. Reverse Voltage vs Reverse Current BV - 1.0 to 100uA Figure 2. Reverse Current vs Reverse Voltage IR - 10 to 100 V Ta= 25 C 450 700 Ta= 25 C Forward Voltage, VF [mV] 1 2 3 5 10 20 30 50 100 Forward Voltage, VF [mV] 650 400 600 350 550 300 500 250 450 0.1 0.2 0.3 0.5 1 2 3 5 10 Forward Current, IF [uA] Forward Current, IF [mA] Figure 3. Forward Voltage vs Forward Current VF - 1.0 to 100 uA Figure 4. Forward Voltage vs Forward Current VF - 0.1 to 10 mA 1.3 Ta= 25 C Ta= 25 C Forward Voltage, VF [V] Total Capacitance [pF] 10 20 30 50 100 200 300 500 1.4 1.2 1.2 1.0 1.1 0.8 0.6 1.0 0 2 4 6 8 10 12 14 Forw ard C urrent, I F [m A ] R everse V oltage [V] Figure 5. Forward Voltage vs Forward Current VF - 10 - 800 mA Figure 6. Total Capacitance vs Reverse Voltage (c)2004 Fairchild Semiconductor Corporation MMBD4148/SE/CC/CA, Rev. A1 MMBD4148/SE/CC/CA Typical Characteristics (continued) 4.0 400 Ta= 25 C Reverse Recovery Time [nS] 3.5 300 3.0 Current [mA] 2.5 200 IF (AV ) -A V ER AG 2.0 ER E CT 100 IF IE DC U RR 1.5 0 EN Tm A 1.0 10 20 30 40 50 60 0 50 100 150 Reverse Current [mA] Ambient Temperature, T A [ C] Figure 7. Reverse Recovery Time vs Reverse Current TRR - IR 10 mA vs 60 mA Figure 8. Average Rectified Current (IF(AV)) versus Ambient Temperature (TA) 500 Power Dissipation, P [mW ] D 400 DO-35 Pkg 300 SOT-23 Pkg 200 100 0 0 50 100 150 200 Average T em perature, I O [ C ] Figure 9. Power Derating Curve (c)2004 Fairchild Semiconductor Corporation MMBD4148/SE/CC/CA, Rev. A1 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM ActiveArrayTM BottomlessTM CoolFETTM CROSSVOLTTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM FPSTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UltraFET(R) VCXTM DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life support 1. Life support devices or systems are devices or systems device or system whose failure to perform can be which, (a) are intended for surgical implant into the body, reasonably expected to cause the failure of the life support or (b) support or sustain life, or (c) whose failure to perform device or system, or to affect its safety or effectiveness. when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Preliminary No Identification Needed Full Production Obsolete Not In Production (c)2004 Fairchild Semiconductor Corporation Rev. I11 |
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